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批踢踢實業坊 Tech_Job 板

[面試] 台積後段封裝

Nov 13th 2013, 22:31, by sthwrong

作者sthwrong (Wrong)

看板Tech_Job

標題[面試] 台積後段封裝

時間Wed Nov 13 22:31:01 2013

小弟剛剛收到台積電的面試通知要面試的是後段封裝的製程整合工程師由於實驗室同學幾乎都是去面試製程整合RD(20nm&10nm) 也不知道我為什麼會被挑到這個部門對這個職稱的工作內容並不是很了解所以想請教一下有沒有面試相關訊息及工作內容或未來發展等感謝~~ -- ※ 發信站: 批踢踢實業坊(ptt.cc) ◆ From: 140.114.233.216

→ ventress:新竹還是台南? 11/13 22:35

→ sthwrong:今天HR打來時忘記問@@ 但是我履歷上只勾竹科中科而已 11/13 22:38

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